Unichem Application Lab

A punching service within Unichem Industries. Small hole punching is available for the Hybrid Interconnect Industry, the Printed Wiring Industry, and Flex Circuit Industry where drilling of very thin non-supported green tapes, coverlay, polymides, etc. is not a viable alternative.

  • Superior Hole Quality
  • Straight And Cleaner Side Walls
  • Enhanced Adhesive Conformability
  • No Cleaning Processes Required
  • No Support Materials Required (I.E. Back-Up, Entry, Masks)    
  • Less Handling
  • Extremely Tight Tolerances Of Round & Irregular Shaped Holes
  • Superior Yields / A Very Cost Effective Process
  • 18” X 24” Panel Size Capability

Unichem Application Lab

A punching service within Unichem Industries. Small hole punching is available for the Hybrid Interconnect Industry, the Printed Wiring Industry, and Flex Circuit Industry where drilling of very thin non-supported green tapes, coverlay, polymides, etc. is not a viable alternative.

  • Superior Hole Quality
  • Straight And Cleaner Side Walls
  • Enhanced Adhesive Conformability
  • No Cleaning Processes Required
  • No Support Materials Required (I.E. Back-Up, Entry, Masks)    
  • Less Handling
  • Extremely Tight Tolerances Of Round & Irregular Shaped Holes
  • Superior Yields / A Very Cost Effective Process
  • 18” X 24” Panel Size Capability