Prepreg
Tooling Systems
Copper
Foil Tooling Systems
Flex
Circuit Target Punches
Flex
Circuit Finishing Punches
Reel
to Reel Flex Circuit Punches
Target
Drills
Ceramic
Green Sheet Punches
Ceramic
Green Sheet Cutters
Ceramic
Green Sheet Via Inspection
Specialized
Tooling
High
Resolution Screen Printing Equipment
CCD
Camera Alignment
Via
Fill, Conductor, & Solder Paste printing
Squeegees,
Screens, Squeegee sharpeners & Other Support
Equipment
Conveyorized
Via Inspection for
Printed Circuit Boards
Conveyorized
Via Inspection
for Ceramic Green Sheet
"Golden-board"
method or comparison with CAD data
Windows-based
software environment
Conveyorized
Screened Ink Drying
Vertical
or Horizontal
Isostatic
Green Ceramic Lamination
Collation
and Stacking
CCD
Camera Alignment
Mylar
Removal
New
Blades
Drilling
Equipment Spares & Consumables
Filtrator
Photoresist Particle Separation System
Blade
Sharpening Service
UHT
Hand Grinders
PCD
& BZN Tooling
Grinder Brochures:
Dryfilm
photoresist width up to 30" (762mm), panel sizes
up to 31" wide
Lateral
cutting for oversize dry film
Suitable
for innerlayer or rigid panels, full range from .004"-.5" thickness
Automatic
setup of parameters & auto, tuning for panel exit temperature
Preset
for automatic in-line operation, easy handshake with other units
High
lamination temperature
Platen
temperatures individually controlled
Upper
platen automatically lifted
Completely
controlled by PLC & self-diagnostic
• Vibratory
equipment for small parts alignment prior to insertion
or processing.
• Handles
connector pins, capacitors, ceramic
chips, PGA sockets, transistors, etc
• Can be
used in some assembly operations
100%
Fiber Free
Static
dissipative to minimize the risk of ESD
Excellent
Abrasion Resistance to reduce particle generation during use
Ideal
for cleaning metal masks used to print LTCC components,
capacitors, EL, OLED and Plasma Display Panels
Will
not interfere with the curing of elastomers, platinum cured
silicones or adhesives
Stencil,
Thick Film Screen and Medical Device wiping applications and
removal of solder paste, conductive adhesives and thick film
inks
Click
on the link for a specification sheet: